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Hi,
After I reballed by iPhone 6s nand ic using stencil, I broke one pad(3rd row from top). Can someone tell me whether that pad matters or not? You can see the photo:
Front Image and Back Image(IC flipped towards left )
Here is the NAND IC diagram from REWA technology:
Can you please compare the IC pads with those in the image to confirm whether it’s okay to proceed with this IC.
Thanks
Bu iyi bir soru mu?
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That’s a ground pin, it should be fine even without it.
Bu yanıt yardımcı oldu mu?
Thanks for the answer. I will solder it and see how it goes. I can see on the schematics these pads are shown as red and white/greyish dots. Are white dots ground or red ones are ground?
@xoheyb I can't tell for sure, it depends on the color attributes one decides to use on his boardview sotware. I'd be inclined to think white is for ground and red for active pads.
@arbaman I have added a photo and edited my question for more information. Can you please have a look? Thanks
@xoheyb That's correct of course, white is ground and grey unconnected. Remember the direction of the chip, your picture is upside down when compared to boardview.
Thanks for your reply @arbaman. Okay so the broken pad on the IC i posted is one for those grey coloured pads in bottom portion of the IC schematic right? And I can use this IC without any fear of damage caused by broken pad. I was actually comparing the broken pad(5th pad on 4th row from top) to the same top row on the schematic and was confused as there is a red pad. So it’s upside down.
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