Xiaomi mi9 found out there is not any UV glue on SOC and memory component.
I watched lots of teardown video for other phones, its like 99% will use UV glue to protect the SOC, But Xiaomi official claim its not necessary.
So I want to find out it’s true or not.
thx
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The pro’s and con’s of using underfill is complex.
It’s used to offer additional support for larger components on devices that tend to flex like cellphones. More makers are using it to help reduce product failure. It also helps prevent wicking of liquids under the chip so in a way it offers a bit of protection.
The bad part of underfill is it gets in the way of servicing the device as it can make it harder to get to test points and if the component needs replacing it can get in the way. And lastly, the servicer should put it back after the repair.
I personally don’t work on Xiaomi devices so I can’t speak for them. Why are you worried?
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every company will do that underfill thing, but not xiaomi, lots of xiaomi phone dont do that, such as mi9... which is my phone... i think thats why they are cheaper than other brands
Maybe they are just the last one to the party ;-}
If this is important to you I would fire off a few emails to Xiaomi complaining, lastly you do have a vote by buying a different phone.
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Technically the term is Underfill not UV glue
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