3. Adımdaki Değişiklikler
Düzenleyen: Kyle Smith —
Düzenleme onaylandı tarafından Kyle Smith
- Önce
- Sonra
- Değiştirilmemiş
Adım Satırları
| [* black] Insert a spudger underneath the shield plate along the edge of the device. | |
| [* icon_reminder] Pry up to lift the shield plate up. | |
| [* icon_note] You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste. | |
| - | [* icon_note] If you weren't able to peel the foam pad as indicated in the previous step, this foam pad will prevent a complete lift up of the plate. To solve this, after beating the resistance from the thermal paste between the plate and the heatsink carefully lever the plate using [link|https://eustore.ifixit.com/products/ifixit-opening-tool|an opening tool] to separate the plate from the pad. |
| [* black] Remove the shield plate. | |
| [* icon_reminder] A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our [guide|744|thermal paste guide|new_window=true] to remove the old thermal compound and replace it with an appropriate, thick compound such as [https://www.amazon.com/viscous-thermal-paste-replacement-Aspire/dp/B01GQ7TFTM/ref=sr_1_4?ie=UTF8&qid=1508975365&sr=8-4&keywords=k5+pro&tag=ifixitam-20|K5 Pro|new_window=true] during reassembly. |