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Uyarı: Ön koşul olan bir kılavuzu düzenliyorsunuz. Yapacağınız herhangi bir değişiklik bu adımın yer aldığı bütün 8 kılavuzları etkileyecektir.

İngilizce
Fransızca

Adım 22 çevriliyor

Adım 22
In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place. As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case. The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.
  • In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place.

  • As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case.

  • The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.

Dans les prochaines étapes, vous utiliserez un iOpener pour chauffer la coque arrière de l'iPad et ramollir l'adhésif maintenant la carte mère en place.

Lorsque vous réchauffez et placez l'iOpener à chacun des emplacements indiqués, laissez-le en place pendant au moins une minute pour ramollir l'adhésif à travers la coque.

L'adhésif se présente sous la forme de six morceaux de ruban de mousse noire – reportez-vous à cette étape pendant que vous vous occupez de réchauffer et décoller pour savoir où se trouve chaque morceau.

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