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Adım 6
Repeat the previous heating and cutting procedure for the remaining three sides of the phone. Leave an opening pick on each side as you continue to prevent the adhesive from resealing. Don't cut too deep on the top or bottom, or you may damage the front-facing sensors or speaker assembly on the top, or capacitive buttons on the bottom.
  • Repeat the previous heating and cutting procedure for the remaining three sides of the phone.

  • Leave an opening pick on each side as you continue to prevent the adhesive from resealing.

  • Don't cut too deep on the top or bottom, or you may damage the front-facing sensors or speaker assembly on the top, or capacitive buttons on the bottom.

Repite el calentamiento previo y el procedimiento de corte para los tres lados restantes del teléfono.

Deja una púa de apertura en cada lado para evitar que el adhesivo se siga resellando.

No cortes demasiado profundamente en la parte superior o inferior o podrías dañar los sensores frontales o el ensamblaje de altavoz en la parte superior, o los botones capacitivos en la parte inferior.

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