I was quite surprised that flux wasn’t mentioned anywhere in this guide - and the pictures are proof that none was used.
…or a vacuum removal tool. Ceramic caps are absolutely notorious for cracking when overheated. Cracks=shorts in MLCC.
Halleluiah! Liquid flux in a needle bottle is almost as important as the solder itself. Also, you need to tin that soldering iron tip!
Add liquid flux to each pad before inserting the wires.
The lack of solder flux here is the reason these joints wouldn’t get anywhere close to being passed by QA. Add flux and try again.
ADD LIQUID FLUX before doing this step. No mention of flux yet and we’re at Step 4? Maybe we need a guide for the guide!
Yikes. This is a horrible step. It risks tearing the pad and the via, and it also stretches the FR4 which would create microfractures in the internal layers. Use a lead that the same size or smaller than the hole if you absolutely have to clear it like this. Jamming a scribe into the hole is no bueno!
Absolutely get some liquid flux involved here. Flux prevents the hot solder from oxidizing and keeps the liquid metal flowing - either into solder wick or a vacuum sucker.
It looks like they potted the whole unit in this clear glue. Is it soft goo, like hot glue, or is it hard like epoxy? Does it soften with heat? I'd love to see the business-end of the charger electronics...
The wireless charging antenna inside the base is certainly compact and cute. Looks like it's not a continuous wire loop, but a U-shape printed "coil". Is this Qi-based, or something proprietary like I'd expect?
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