BigPapa76 \, before tearing it apart connect an external monitor and see what it displays. If it does not, then read my answer to a very similar question :" this series has an issue with the GPU failing. Sometimes a reball can fix it, other times you may need a new logic board. Here is my answer to a similar question :"
This is a well documented prob with this series of notebooks and if you do a search on the Internet you'll find lots and lots of unhappy and frustrated people. The problem is the motherboard, and the symptoms include loss of bootup, VERY slow bootup, WiFi stops working, etc. is simply that the MOBO board overheats and fries the video driver chip. The cooling design of this PC is inadequate.
You might try this to verify.
1. Take the battery out and unplug the charger
2. With the computer lights OFF, press and hold down the power button for 15 seconds
3. Plug the charger back in and start-up the computer
to fix the problem you will have to reflow the graphics chip.
If an external monitor displays properly, you have a bad LCD.
Just for completion sake and pointing out things that were "discovered" about this since 2015. It is the same chip design as was used for the Xbox360, PS3 and multiple other products.
You most likely have issues with your GPU processor. It is a flip chip design and the issue could be the solder bumps between the IC and the substrate.. Combining this with a reflow with a heat gun may just complete a good repair. Check on here for the reflow guide. Also "remember that all that this kit is trying to accomplish, is to close cracked solder joints.
Here is a very "quick and dirty" explanation of what causes most of the RROD. It is not always a failure of the solder balls which connect the Flip Chip BGA package to the motherboard. It does happen and you can see why on here More commonly however is that the failure is due to the chip design itself.
As you can see the "bumps" are what actually connects the die to the substrate to make the chip complete. If these bumps fail the die does no longer make contact with the substrate and thus no contact with the circuit board. The chip has failed.
Here you can see the space where the bump has failed and no longer makes contact. We are talking microns of space here. So a bit of pressure on the top of the die potentially close the gap. Same with a reflow, it may allow some of material from the bump to reshape and starting to make contact again. The heating of cooling of the chip during use is what will eventually cause it to fail again.
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